Single wafer Annealing system “TANDUO®”
Overview
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TANDUO® provides an optimized system for the process such as curing, annealing and degassing by module selection.
We have achieved great productivity and low particle process environment with our original high-speed wafer transfer system.- Process Applications
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- Low temp Annealing
- Curing
Features
- Achieved high throughput with our original high-speed wafer transfer system
- Achieved highly uniform temperature control capability within wafer using our original susceptor heater
- Low contamination level
- Small footprint, high tool up-time
- Global tool sales record as a high throughput single wafer annealing system by high productivity